Demo Stage 2025

Scaling AI accelerators only happens with extreme density and high-speed performance interconnects. Samtec’s Si-Fly® HD co-packaged interconnect systems provide the highest density 224 Gbps PAM4 solution in today's market. Electrically pluggable co-packaged copper and optics solutions (known as CPX) adjacent to AI accelerators are achievable on a 95 mm x 95 mm or smaller substrates. This proximity eliminates long PCB traces, greatly reducing loss while preserving serviceability in a pluggable form factor. In the Demo Stage presentation, Samtec technical experts will summarize real-world performance data of CPX implementations in various 224 Gbps PAM4 signal channels typically found in AI acceleration platforms. Additionally, an preview of AI scale-up and scale-out networks using CPX technologies will also be presented.