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Phononic, Inc. is the preeminent leader in solid state cooling solutions for data centers, deployed across every major hyperscaler today with a suite of thermoelectric devices and designs, for networking, GPUs, and AI data centers. Phononic’s portfolio of cooling solutions for AI data centers deliver cooling when and where it is needed so as to optimize AI infrastructure, minimizing overprovisioning, delivering cooling in millisecond timing, unlocking performance, and dramatically improving ROI, useful lifetime, and energy efficiency.

Phononic’s Thermal Kits for GPU high‑bandwidth memory (HBM) and co‑packaged optics (CPO) combine high‑performance thermoelectric coolers (TECs) with an integrated mechanical and thermal architecture, supported by API‑accessible control firmware and software. Embedded firmware and Redfish‑compatible interfaces deliver real‑time analytics and system visibility, enabling predictive cooling, precise workload placement, and a deterministic thermal envelope. The solution provides targeted, performance‑enhancing cooling at the node and chip level, directly addressing thermal hot spots instead of relying solely on bulk liquid cooling methods.

When deployed at thermal hot spots throughout the data center, Phononic’s Thermal Kits collectively form the Phononic Thermal Fabric™, enabling true workload orchestration through proactive, pre‑emptive cooling and two‑way telemetry. With millisecond‑level response, the system continuously optimizes thermal performance to improve efficiency, boost compute performance, and reduce time‑to‑completion for the most demanding AI workloads. This architecture also enables data‑center‑wide increases in facility water temperatures while maintaining precise chip‑level thermal control, allowing operators to improve energy efficiency, unlock additional performance, and extend system lifespan.

For additional Company and product information visit: www.phononic.com.