Universal Chiplet Interconnect

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The UCIe Consortium is an industry consortium dedicated to advancing UCIe™ (Universal Chiplet Interconnect Express™) technology, an open industry standard that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. ABC Consortium is led by key industry leaders Advanced Semiconductor Engineering, Inc. (ASE), Alibaba, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, NVIDIA, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company, and represents more than 130 member companies. For more information, visit www.UCIexpress.org.
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White Paper - UCIe 3.0 Specification: Driving Innovation for Efficient, Scalable, and Reliable Chiplet Integration

01 Sep 2025 Universal Chiplet Interconnect Dr. Debendra Das Sharma
UCIe 3.0 enhances chiplet interconnects with doubled data rates to 64 GT/s, supports continuous transmission, improves power efficiency, and introduces manageability features like firmware download, p …
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