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03 Sep 2026
Amphenol to Showcase The Full Spectrum of Data Center Connectivity
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Artificial intelligence is transforming the data center across compute, memory, power, optics, and thermal systems. As
AI infrastructure advances, interconnects are evolving to meet the demands of increasingly complex system
architectures, enabling not just connectivity, but also performance, reliability, and platform-level integration.
Amphenol will be showcasing advanced AI connectivity solutions at the AI Infra Summit 2026, taking place
September 15–17 at the Santa Clara Convention Center. Amphenol will showcase a broad portfolio that includes optics,
copper, power, memory, storage, GPU, liquid cooling, and leak detection solutions. Together, these offerings are
designed to support the performance, density, and thermal requirements of next-generation AI infrastructure.
Visit Booth 604 to explore these industry-leading technologies, along with live demos featuring high-performance
448G co-packaged copper solutions and optical interconnectivity.