Sponsor Editorial

Phononic, the preeminent global leader in solid state cooling technology for AI data centers, has expanded its data center cooling portfolio with new solutions for 1.6T pluggable transceivers, along with integrated Thermal Kits™ for GPU high-bandwidth memory (HBM) and co-packaged optics (CPO). Through these innovations, Phononic is redefining cooling as a real-time, chip-level control layer for AI systems. Purpose-built for modern AI data centers, these high-performance cooling solutions reduce thermal throttling, enhance compute performance, extend device useful life by up to 5×, improve PUE by up to 0.15, and deliver up to 3× return on investment. In addition, Phononic introduced its Thermal Fabric™, that forms a coordinated thermal control network that enables fleet-wide workload optimization across data center infrastructures.