Sponsor Editorial

AI workload density keeps climbing. Traditional air cooling is dead. Direct liquid cooling works, but legacy manufacturing limits what's possible, conventional cold plates force tradeoffs between thermal performance and pressure drop. Add more cooling channels and you lose structural rigidity. Simplify the design and you sacrifice heat transfer.

Alloy's proprietary manufacturing process changes the equation. By building single piece, leak-tight copper components layer by layer, it unlocks internal geometries that traditional machining can't touch: parallel Microcapillary™ channels, 3D infill structures, embedded flow control. No discrete parts. No assembly risk. No tooling delays.

The result: significantly lower pressure drop than industry-leading competitors. Better thermal performance. Faster customization for any chip or board layout. Built for 600 kW racks and beyond.

See the technology. See the benchmarks. See what's possible when you redesign manufacturing instead of settling for better integration.

Download the whitepaper.