Sponsors

Winbond Electronics is one of the select few IDM memory companies with its own wafer fabrication plants, manufacturing process technology, and product development teams. The company offers customer-focused solutions powered by its exceptional expertise in product design, research and development, manufacturing, and global brand promotion.

Winbond's extensive product portfolio includes Code Storage Flash and TrustME® Secure Flash, alongside Customized Memory Solutions (CMS). These products are widely trusted by tier 1 customers across industries such as communications, consumer electronics, automotive, industrial applications, and computer peripherals.

Winbond’s CUBE solution is designed to enhance memory bandwidth and address the rising demands of AI computing at the edge. CUBE offers a high-bandwidth, power-efficient, compact, and cost-effective memory solution, perfectly suited for AI applications. This ready-to-deploy technology provides immense value for module makers and System-on-Chip providers.

Headquartered in the Taichung city of Taiwan, Winbond operates subsidiaries in the USA, China, Japan, Germany, India, Korea, Hong Kong, Singapore, and Israel. The company also operates two own cutting-edge 12-inch fabrication facilities in Taichung and Kaohsiung. Through these facilities, Winbond continues to drive innovation by developing in-house technologies to deliver top-quality integrated circuit products and services.