Cadence
Website: https://www.cadence.com/en_US/home.html
Cadence’s goal is to empower engineers at semiconductor and systems companies to create innovative, intelligent, and highly differentiated electronic products that transform the way people live, work, and play. The company’s Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to systems—in AI, IoT, mobile, 5G, consumer, cloud, data center, automotive, aerospace, and other market segments. Cadence offers specialized IP with industry-leading performance, power efficiency, and interconnects, as well as AI-specific verification and implementation solutions. The company also employs machine learning within its tools and solutions to enable the best power, performance, and area (PPA), quality of results (QoR), and time-to-market (TTM) benefits.
Flexnode
Website: https://flexnode.io/
Flexnode designs, builds, and operates high density, rapidly-deployed, scalable modular data centers purpose-built for today and tomorrow’s most complex IT projects. Supporting 150kW+ racks, Flexnode’s data centers are AI-ready, specifically designed for today’s leading chipsets (i.e., NVIDIA GB200/B300, AMD MI355X) and future developments. Flexnode works closely with our clients to configure modular solutions to meet their exact needs. In addition, Flexnode works closely with all major hardware, cooling, and networking providers, giving its clients optionality while also ensuring solutions are precisely configured to optimize their IT initiatives. Flexnode’s modular design enables deployments from 1MW to 300MW+, reduces design-build time and construction material waste, while delivering industry-leading rack densities, PUE and resiliency. With densities increasing significantly, Flexnode’s modular design is a fast, reliable, and cost-effective way to deploy both today and tomorrow’s chipsets without sacrificing capex, power, space, or operability. In collaboration with best-in-class data center design, engineering, and construction partners, Flexnode delivers on projects ranging from 50kW to 1MW racks, to underpin vital AI initiatives globally.
Siemens
Website: https://eda.sw.siemens.com/en-US/
Siemens is rapidly expanding our number one position in digital industrial software to enable our customers to swiftly advance in their digital transformation. With the un-matched breadth and depth of the Siemens Xcelerator portfolio, Siemens is enabling customers to leverage AI to break down the barriers between their electrical, mechanical and software design silos, between their design, manufacturing, and ERP silos within all markets. It enables customers to bridge the virtual and physical design and manufacturing worlds, empowering customers to rapidly evolve from systems to market-leading ecosystems companies so they can leverage AI to engineer a smarter future faster – and deliver smart products, factories, infrastructure, and cities – for us all.
Moderator
Richard Curtin
Managing Partner
Silicon Catalyst
Silicon Catalyst
Website: https://siliconcatalyst.com/
Please visit our website for more information.Semiconductor development faces increasing complexity, faster timelines, and fierce competition, exposing the limitations of traditional EDA tools. In response, AI Agents, powered by LLMs and advanced algorithms, are emerging as next-gen solutions. This session explores how these agents surpass conventional automation by independently managing tasks like hardware modeling, constraint solving, debugging, testbench creation, and design optimization. We'll cover real-world use cases showing how AI Agents deliver improved productivity, design quality, and time-to-market, including their ability to autonomously detect bugs and optimize RTL designs.
Mehir Arora
Founding Engineer
ChipAgents
Mehir Arora is a founding engineer at ChipAgents, a company at the forefront of integrating agentic AI into Electronic Design Automation (EDA) workflows. Graduated from UC Santa Barbara, Mehir has contributed to advancing state-of-the-arts in AI methodologies, including a paper presented at ICML 2024. At ChipAgents, he focuses on developing agentic AI tools that enhance chip design and verification processes, aiming to significantly improve efficiency and productivity in semiconductor engineering.
Arm
Website: https://www.arm.com/markets/artificial-intelligence
Arm is the industry’s highest-performing and most power-efficient compute platform with unmatched scale that touches 100 percent of the connected global population. To meet the insatiable demand for compute, Arm is delivering advanced solutions that allow the world’s leading technology companies to unleash the unprecedented experiences and capabilities of AI. Together with the world’s largest computing ecosystem and 20 million software developers, we are building the future of AI on Arm.
