Co-packaged optics (CPO) is shaping up to be one of the biggest architectural decisions in AI infrastructure over the next few years.
Join Ayar Labs for the CPO Summit, an invite-only breakfast briefing at AI Infra Summit on Wednesday, September 16, from 8:00–9:10 AM. This session brings together compute, hyperscaler and ecosystem leaders for a focused conversation on what's actually shaping CPO adoption right now, from ecosystem readiness and high-volume manufacturing to the OCI-MSA protocols and the path to optical scale-up.
Please complete the form below to request an invitation. Registration includes a full breakfast and access to the AI Infra Summit Expo Hall.
Preliminary Agenda*
Welcome Remarks
Mark Wade
CEO, Ayar Labs
Executive Keynote
Pat Gelsinger
General Partner, Playground Global; former CEO, Intel
An executive perspective on the AI infrastructure inflection point and why co-packaged optics is central to it.
CPO Supply Chain Readiness: An Ecosystem Roundtable
Industry leaders across the CPO supply chain — silicon, systems and networking — reveal what's actually possible for next-generation AI infrastructure roadmaps.
Moderator:
Sally Ward-Foxton
Senior Reporter, EE Times
Featuring:
Harold Liu
Executive Director - Pioneering Center, Wiwynn
Barun Kar
Co-Founder/President and CEO, Upscale AI
Matthew Sysak
CTO, Lumentum
OCI-MSA: Building an Open, Interoperable Optical Interconnect for AI Scale-Up
Leading AI infrastructure operators discuss CPO and OCI MSA adoption, where barriers remain, and what the ecosystem must deliver to scale.
Moderator:
Sally Ward-Foxton
Senior Reporter, EE Times
Featuring:
Drew Alduino
Director of Optical Infrastructure, Meta
Near Margalit
GM and VP of Optical Systems Division, Broadcom
Matthew Streshinsky
Sr Director, Photonics, AMD
More panelists to be announced
Closing Remarks and Q&A
Mark Wade
CEO, Ayar Labs
Following closing remarks from Mark Wade, join Ayar Labs in the AI Infra Summit Expo Hall at Booth #804 to continue the conversation.
*Agenda and speakers subject to change.
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